Design pitfalls that can lead to solder shorts during wave solder

Industry expert Bob Willis provides more technical assistance with help from the National Physical Laboratory (NPL) Defect Database.

What can I do about LGA/QFN Packages “Floating” During Reflow

Industry expert Bob Willis explains why LGA/QFN packages may float during reflow and how this defect may be associated with excess voids and open solder joints. Want to hear more? Willis will be speaking at a free webinar on January 12. Learn more and register now at http://www.ipcapexexpo.org/defects-webinar. In addition, he will be the featured […]

Bob Willis Provides Ideas for Identifying Counterfeit Components

Industry expert Bob Willis explains some nondestructive methods for identifying counterfeit components — before they go on your boards. Want to hear more? Willis will be speaking at a free webinar on January 12. Learn more and register now at http://www.ipcapexexpo.org/defects-webinar. In addition, he will be the featured presenter at the NPL Defect Database Clinic […]

Problems with Incomplete Reflow on “Intrusive” Solder Joints

Generally a reliable solder method, companies can experience problems with incomplete reflow on “intrusive” solder joints, i.e. “pin in paste” or reflow on through hole components. 90% of the time, a faulty profile is the culprit. Check out Bob Willis’s analysis of the phenomenon with illlustrations from the NPL Defect Database.

What are the guidelines for halide content in solder flux?

IPC Vice President David Bergman answers this online technical question from Brazil with reference to J-STD-004

Explaining the IPC standards development process

Technical Question of the Week: Explaining the IPC standards development process