Monthly Archives: October 2009

How do IPC standards address solder mask adhesion testing?

David Bergman addresses the issues involved in solder mask adhesion testing.

What standards does IPC have to address via protection?

John Perry addresses seven types of via protection addressed in IPC-4761 and new developments to be covered in IPC-6012 and IPC-2221.

Explaining the IPC standards development process

Technical Question of the Week: Explaining the IPC standards development process

Which IPC standard should be used in this case of a lifted land?

Technical Question of the Week: Which IPC standard should be used in this case of a lifted land?

What are IPC’s requirements for copper wrap plating in through hole vias?

Technical Question of the Week: What are IPC’s requirements for copper wrap plating in through-hole vias?

What is the IPC standard for current carrying capacity for printed boards?

Technical Question of the Week: What is the IPC standard for current carrying capacity for printed boards?

What’s the big deal with halogen free?

Technical Question of the Week: Whats the big deal with halogen free?

Is there a limit on the number of times a component can be baked?

Technical Question of the Week: Is there a limit on the number of times a component can be baked?

What is the right standard to use for qualifying PCBs IPC-A-600 or IPC-6012?

Technical Question of the Week: What is the right standard to use for qualifying PCBs IPC-A-600 or IPC-6012?

How to Understand Acceptance Testing Frequency within IPC 6012

Technical Question of the Week: How to understand acceptance testing frequency within IPC-6012