Tag Archives: boards

Critical contact and pristine areas in IPC-A-600

IPC Vice President David Bergman uses IPC-A-600 to discuss critical contact area, pristine area and witness marks and how the terms apply to connectors, bonding pads, SMT and BGA lands.

Do IPC standards require solder mask to be green?

IPC Vice President David Bergman explains what IPC-SM-840D says about solder mask.

What are acceptability requirements for a board…?

IPC Vice President David Bergman explains new requirements from IPC-A-610 for soldering two boards together.

What are feature location tolerances for rigid flex boards?

IPC Vice President David Bergman discusses use of IPC specifications for manufacturing tolerances and the meaning of producibility levels A, B and C.

Does my company need to start using the new revision of a standard?

IPC Vice President David Bergman answers this online technical question regarding what EMS companies should do about the new revision to IPC-A-610

What are the guidelines for halide content in solder flux?

IPC Vice President David Bergman answers this online technical question from Brazil with reference to J-STD-004

How is IPC-2221 used to calculate insulation requirements?

IPC Vice President David Bergman answers this online technical question and clarifies requirements between conductors and between layers.

Does gold plated solder cup of connector need tinning per J-STD-001?

IPC Vice President David Bergman discusses gold embrittlement and why tinning is necessary per J-STD-001 in this video technical question.

How to search the IPC Technet Archives

IPC Vice President Dave Bergman explains how to find answers to technical questions about printed boards and assemblies

IPC guidance regarding clearance space between components when designing a printed board

Technical Project Manager John Perry explains the clearance information in J-STD-001, IPC-2221 and IPC-7351.