Wire corrosion

Industry expert Bob Willis uses the NPL Defect Database to explain the outcome of using corrosive flux when soldering wire.

Do IPC standards require solder mask to be green?

IPC Vice President David Bergman explains what IPC-SM-840D says about solder mask.

Thermal Stress Test Methods: What are the new IPC requirements?

IPC Technical Project Manager John Perry discusses the new convection reflow thermal stress test method in comparison to the older solder float test.

What are the guidelines for halide content in solder flux?

IPC Vice President David Bergman answers this online technical question from Brazil with reference to J-STD-004

Does gold plated solder cup of connector need tinning per J-STD-001?

IPC Vice President David Bergman discusses gold embrittlement and why tinning is necessary per J-STD-001 in this video technical question.

Are through-hole parts connected through a common conductor acceptable?

IPC Vice President David Bergman answers this video tech question of the week on whether parts joined by design form an unacceptable solder bridge.

Are solder balls remaining on an assembly after production acceptable?

IPC Vice President of International Relations answers the IPC Video Technical Question of the Week, discussing solder balls and solder mask.

What is the desired amount of pull testing on SMT component solder connections?

Technical Question of the Week: What is the desired amount of pull testing on SMT component solder connections