IPC Technical Project Manager John Perry discusses the new convection reflow thermal stress test method in comparison to the older solder float test.
-
Recent Posts
- Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to ‘F’ Revisions
- PCB Delamination and How it Occurs
- Solder Stencil Inspection
- SMT Adhesive Inspection
- HiPHoP Explained
- PCB Bowing and Twisting
- Wire corrosion
- Cracking on Single-sided Printed Boards
- Package on Package Popcorning
- Plated-Through Hole Damage
Categories
- Assembly (42)
- Compliance (1)
- Lead Free (5)
- NPL Defect Database (6)
- Printed Circuit Boards (47)
- Repair (7)
- Rework (5)
- Solder (3)
- Testing (1)
- Uncategorized (6)
Archives
- October 2014
- June 2014
- November 2013
- August 2013
- July 2013
- May 2013
- April 2013
- February 2013
- January 2013
- November 2012
- October 2012
- September 2012
- August 2012
- July 2012
- June 2012
- April 2012
- March 2012
- February 2012
- January 2012
- December 2011
- October 2011
- September 2011
- August 2011
- June 2011
- May 2011
- April 2011
- March 2011
- February 2011
- January 2011
- November 2010
- October 2010
- August 2010
- July 2010
- June 2010
- May 2010
- April 2010
- March 2010
- February 2010
- January 2010
- December 2009
- November 2009
- October 2009
- September 2009
IPC Tech Question Online 