Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to ‘F’ Revisions

Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to include technical advances in SMT components, new criteria for P-style and solder-charged Butt/I terminations, change to void criteria for BGAs, and more.

Plated-Through Hole Damage

Industry expert Bob Willis uses the NPL Defect Database to explain common causes of damage to plated-through holes.

What are the problems I can look out for with crimp terminations?

Industry consultant and SMT guru Bob Willis troubleshoots the challenges of using crimp terminations using the National Physical Laboratory’s Process Defect Database.

How can I assess bake out and moisture loss for printed boards?

This month’s defect of the month focuses on baking PCBs and measuring the moisture loss with a new technique to add accuracy and take the guesswork out of the process. For more information, we have provided links to a webinar recording, technical paper and presentation slides: NPL Webinar: Effectiveness of Baking to Remove Moisture from […]

Using the Water Break Test to Evaluate Surface Cleanliness

Industry expert Bob Willis explains how the water break test can find adhesive or conformal coating dot residues. While not a chemical test, the water break test can be conducted quickly and easily on the factory floor. Illustrations are provided by the National Physical Laboratory Defect Database.

Solder Mask Outgassing

Industry expert Bob Willis explains solder mask outgassing defects with the help of the NPL Defect Database.  

How can I measure conformal coating thickness

Industry expert Bob Willis explains the use of “sticky dots” with the help of the NPL Defect Database.  

Explanation of different PoP inspection techniques

Industry expert Bob Willis explains the three available options of x-ray, optical and process monitoring for inspection of package-on-package assemblies. Want to hear more? Willis will be speaking at a free webinar on January 12. Registration is coming soon. In addition, he will be the featured presenter at the NPL Defect Database Clinic on the […]

What are the causes for solder skips?

 Bob Willis looks at the most common reasons for solder skips on surface mount during wave soldering and illustrates how pad length, solder mask thickness and gassing from solder mask and flux will contribute to the problem.   Bob, in conjunction with the National Physical Laboratory Defect Database, will have an on-site clinic at IPC […]

Do I need to clean my no-clean assembly?

IPC Manager of Assembly Technology Kris Roberson explains how the new IPC-CH-65 may change your views on cleaning. Learn more about IPC-CH-65B.