Generally a reliable solder method, companies can experience problems with incomplete reflow on “intrusive” solder joints, i.e. “pin in paste” or reflow on through hole components. 90% of the time, a faulty profile is the culprit. Check out Bob Willis’s analysis of the phenomenon with illlustrations from the NPL Defect Database.
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IPC Tech Question Online 
One Comment
I agree, but can an inadequate solder paste volume also create this type of problem?