Category Archives: Repair

Plated-Through Hole Damage

November 30, 2012 – 7:57 pm

Industry expert Bob Willis uses the NPL Defect Database to explain common causes of damage to plated-through holes.

By Sandy Gentry | Also posted in Printed Circuit Boards, Rework | Tagged , , | Leave a Comment

Do IPC standards require solder mask to be green?

October 12, 2010 – 4:35 pm

IPC Vice President David Bergman explains what IPC-SM-840D says about solder mask.

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How to make sure you’re using the most recent revision of IPC standards

January 20, 2010 – 7:54 pm

IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.

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Can you use a bare board requirement to reject a completed assembly?

January 5, 2010 – 2:37 pm

IPC answers the video technical question of the week about rejecting an assembly for a bare board defect under IPC-A-600.

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Are the requirements for hot tear in IPC-A-610 too restrictive?

October 7, 2009 – 4:03 pm

Technical Question of the Week: Are the requirements for hot tear in IPC-A-610 too restrictive?

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How Many Repairs are Acceptable on an Assembly?

October 5, 2009 – 7:56 pm

Technical Question of the Week: How Many Repairs are Acceptable on an Assembly?

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Revision Changes to IPC-7711 & 7721

September 30, 2009 – 7:54 pm

Technical Question of the Week: Lead Free Rework

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