Industry expert Bob Willis uses the NPL Defect Database to explain package on package popcorning which could result in open circuits and solder shorts.
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Recent Posts
- Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to ‘F’ Revisions
- PCB Delamination and How it Occurs
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- Package on Package Popcorning
- Plated-Through Hole Damage
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