Monthly Archives: March 2010

How is IPC-2221 used to calculate insulation requirements?

March 30, 2010 – 3:23 pm

IPC Vice President David Bergman answers this online technical question and clarifies requirements between conductors and between layers.

By IPC | Posted in Assembly, Printed Circuit Boards | Tagged , , , , , , , , , , , , | Leave a Comment

What are the guidelines for placement of the humidity indicator card and a dessicant package?

March 23, 2010 – 2:27 pm

IPC Vice President David Bergman answers this online technical question with reference to current and future content from J-STD-033.

By IPC | Posted in Assembly, Printed Circuit Boards | Tagged , , , , , , , , | Leave a Comment

Does gold plated solder cup of connector need tinning per J-STD-001?

March 10, 2010 – 11:10 pm

IPC Vice President David Bergman discusses gold embrittlement and why tinning is necessary per J-STD-001 in this video technical question.

By IPC | Posted in Assembly, Printed Circuit Boards | Tagged , , , , , , , , , , , , , , | Comments (1)

Are through-hole parts connected through a common conductor acceptable?

March 1, 2010 – 3:14 pm

IPC Vice President David Bergman answers this video tech question of the week on whether parts joined by design form an unacceptable solder bridge.

By IPC | Posted in Assembly, Printed Circuit Boards | Tagged , , , , , | Comments (1)