Monthly Archives: July 2012

How can I assess bake out and moisture loss for printed boards?

This month’s defect of the month focuses on baking PCBs and measuring the moisture loss with a new technique to add accuracy and take the guesswork out of the process. For more information, we have provided links to a webinar recording, technical paper and presentation slides: NPL Webinar: Effectiveness of Baking to Remove Moisture from […]