Category Archives: Lead Free

Causes of Solder Fillet Lifting

While it is not linked directly to solder reliability, solder fillet lifting can be worrisome. Where is it seen? What are its causes? Check out Bob Willis’s analysis of the phenomenon with illlustrations from the NPL Defect Database. Get your questions answered by Bob Willis in person at the free process defect database clinic at […]

Causes and solutions for popcorn defects in plastic packages

Industry guru Bob Willis discusses the causes of component cracking in rework and soldering and the solution: check out IPC standards for moisture sensitive components. Bob will provide free help on your problem boards and assemblies at theĀ FREE NPL Defect Database Clinic at IPC APEX EXPO on April 12-14 on the show floor. With the […]

Where are guidelines for take action limits when using lead free solder found?

Jack Crawford discusses industry concerns about take action limits with lead free solders and where they are found in IPC standards.

Are the requirements for hot tear in IPC-A-610 too restrictive?

Technical Question of the Week: Are the requirements for hot tear in IPC-A-610 too restrictive?

Revision Changes to IPC-7711 & 7721

Technical Question of the Week: Lead Free Rework