Industry expert Bob Willis uses the NPL Defect Database to explain the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.
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Recent Posts
- Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to ‘F’ Revisions
- PCB Delamination and How it Occurs
- Solder Stencil Inspection
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- HiPHoP Explained
- PCB Bowing and Twisting
- Wire corrosion
- Cracking on Single-sided Printed Boards
- Package on Package Popcorning
- Plated-Through Hole Damage
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