What are the problems I can look out for with crimp terminations?

Industry consultant and SMT guru Bob Willis troubleshoots the challenges of using crimp terminations using the National Physical Laboratory’s Process Defect Database.

Design pitfalls that can lead to solder shorts during wave solder

Industry expert Bob Willis provides more technical assistance with help from the National Physical Laboratory (NPL) Defect Database.

How can I assess bake out and moisture loss for printed boards?

This month’s defect of the month focuses on baking PCBs and measuring the moisture loss with a new technique to add accuracy and take the guesswork out of the process. For more information, we have provided links to a webinar recording, technical paper and presentation slides: NPL Webinar: Effectiveness of Baking to Remove Moisture from […]

Using the Water Break Test to Evaluate Surface Cleanliness

Industry expert Bob Willis explains how the water break test can find adhesive or conformal coating dot residues. While not a chemical test, the water break test can be conducted quickly and easily on the factory floor. Illustrations are provided by the National Physical Laboratory Defect Database.

Causes of PCB Delamination

Industry expert Bob Willis explains and shows photos of the causes of PCB lamination defects with help from the NPL Defect Database.

Solder Mask Outgassing

Industry expert Bob Willis explains solder mask outgassing defects with the help of the NPL Defect Database.  

How can I measure conformal coating thickness

Industry expert Bob Willis explains the use of “sticky dots” with the help of the NPL Defect Database.  

What can I do about LGA/QFN Packages “Floating” During Reflow

Industry expert Bob Willis explains why LGA/QFN packages may float during reflow and how this defect may be associated with excess voids and open solder joints. Want to hear more? Willis will be speaking at a free webinar on January 12. Learn more and register now at http://www.ipcapexexpo.org/defects-webinar. In addition, he will be the featured […]

Bob Willis Provides Ideas for Identifying Counterfeit Components

Industry expert Bob Willis explains some nondestructive methods for identifying counterfeit components — before they go on your boards. Want to hear more? Willis will be speaking at a free webinar on January 12. Learn more and register now at http://www.ipcapexexpo.org/defects-webinar. In addition, he will be the featured presenter at the NPL Defect Database Clinic […]

Explanation of different PoP inspection techniques

Industry expert Bob Willis explains the three available options of x-ray, optical and process monitoring for inspection of package-on-package assemblies. Want to hear more? Willis will be speaking at a free webinar on January 12. Registration is coming soon. In addition, he will be the featured presenter at the NPL Defect Database Clinic on the […]