HiPHoP Explained

Industry expert Bob Willis uses the NPL Defect Database to explain the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.

PCB Bowing and Twisting

Industry expert Bob Willis uses the NPL Defect Database to explore techniques to reduce the possibility of board sag.

Cracking on Single-sided Printed Boards

Industry expert Bob Willis uses the NPL Defect Database to explain the causes of solder joint cracks in printed boards.

Package on Package Popcorning

Industry expert Bob Willis uses the NPL Defect Database to explain package on package popcorning which could result in open circuits and solder shorts.

Plated-Through Hole Damage

Industry expert Bob Willis uses the NPL Defect Database to explain common causes of damage to plated-through holes.

Causes of PCB Delamination

Industry expert Bob Willis explains and shows photos of the causes of PCB lamination defects with help from the NPL Defect Database.

Do I need to clean my no-clean assembly?

IPC Manager of Assembly Technology Kris Roberson explains how the new IPC-CH-65 may change your views on cleaning. Learn more about IPC-CH-65B.

How to measure the thermal zone for boards with blind or buried vias.

IPC Technical Project Manager John Perry explains how to measure the thermal zone for boards with blind or buried vias using new concepts developed for the IPC-6012 industry standard.

Causes and tests for outgassing on your through-hole leads.

This is one in a series of videos by industry expert and consultant Bob Willis. Bob will provide free help on your problem boards and assemblies at the FREE NPL Defect Database Clinic at IPC APEX EXPO on April 12-14 on the show floor. With the help of equipment in the booth, Bob can help you […]

Causes and Tests for Pin holes, blow holes and outgassing

Industry expert Bob Willis uses the NPL Defect Database to explain the causes, solutions and tests for outgassing, generally caused by moisture in the printed board board.