Critical contact and pristine areas in IPC-A-600

IPC Vice President David Bergman uses IPC-A-600 to discuss critical contact area, pristine area and witness marks and how the terms apply to connectors, bonding pads, SMT and BGA lands.

Do IPC standards require solder mask to be green?

IPC Vice President David Bergman explains what IPC-SM-840D says about solder mask.

What are acceptability requirements for a board…?

IPC Vice President David Bergman explains new requirements from IPC-A-610 for soldering two boards together.

What are feature location tolerances for rigid flex boards?

IPC Vice President David Bergman discusses use of IPC specifications for manufacturing tolerances and the meaning of producibility levels A, B and C.

Do class 3 plating thickness requirements apply to wrapped copper and copper in the plated-though hole?

IPC Vice President David Bergman discusses how to apply the copper wrap plating requirements from IPC-6012C.

Thermal Stress Test Methods: What are the new IPC requirements?

IPC Technical Project Manager John Perry discusses the new convection reflow thermal stress test method in comparison to the older solder float test.

Does my company need to start using the new revision of a standard?

IPC Vice President David Bergman answers this online technical question regarding what EMS companies should do about the new revision to IPC-A-610

What are the guidelines for halide content in solder flux?

IPC Vice President David Bergman answers this online technical question from Brazil with reference to J-STD-004

How is IPC-2221 used to calculate insulation requirements?

IPC Vice President David Bergman answers this online technical question and clarifies requirements between conductors and between layers.

What are the guidelines for placement of the humidity indicator card and a dessicant package?

IPC Vice President David Bergman answers this online technical question with reference to current and future content from J-STD-033.