Tag Archives: SMT

Critical contact and pristine areas in IPC-A-600

IPC Vice President David Bergman uses IPC-A-600 to discuss critical contact area, pristine area and witness marks and how the terms apply to connectors, bonding pads, SMT and BGA lands.

What is the desired amount of pull testing on SMT component solder connections?

Technical Question of the Week: What is the desired amount of pull testing on SMT component solder connections