Tag Archives: J-STD-033

What are the guidelines for placement of the humidity indicator card and a dessicant package?

March 23, 2010 – 2:27 pm

IPC Vice President David Bergman answers this online technical question with reference to current and future content from J-STD-033.

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Is there a limit on the number of times a component can be baked?

October 7, 2009 – 7:47 pm

Technical Question of the Week: Is there a limit on the number of times a component can be baked?

By IPC | Posted in Printed Circuit Boards | Leave a Comment

What is the correct usage of the humidity indicator card in J-STD-033 for EMS companies?

October 7, 2009 – 3:55 pm

Technical Question of the Week: What is the correct usage of the humidity indicator card in J-STD-033 for EMS companies?

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Can I bake components at higher temperatures than what is allowed in J-STD-033B?

October 6, 2009 – 4:24 pm

Technical Question of the Week: Can I bake components at higher temperatures than what is allowed in J-STD-033B?

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