Solder Stencil Inspection

Industry expert Bob Willis uses the NPL Defect Database to explain the need to inspect the quality and ongoing condition of solder paste stencils.

SMT Adhesive Inspection

Industry expert Bob Willis uses the NPL Defect Database to explain SMT adhesive inspection.

HiPHoP Explained

Industry expert Bob Willis uses the NPL Defect Database to explain the causes of HiPHoP (head-in-pillow/head-on-pillow) and how to address it.

PCB Bowing and Twisting

Industry expert Bob Willis uses the NPL Defect Database to explore techniques to reduce the possibility of board sag.

Wire corrosion

Industry expert Bob Willis uses the NPL Defect Database to explain the outcome of using corrosive flux when soldering wire.

Cracking on Single-sided Printed Boards

Industry expert Bob Willis uses the NPL Defect Database to explain the causes of solder joint cracks in printed boards.

Package on Package Popcorning

Industry expert Bob Willis uses the NPL Defect Database to explain package on package popcorning which could result in open circuits and solder shorts.

Plated-Through Hole Damage

Industry expert Bob Willis uses the NPL Defect Database to explain common causes of damage to plated-through holes.

Solderability Testing for Bottom Termination Components

When the traditional tests of dip and look or solder float don’t do the trick, industry expert Bob Willis has some suggestions for more accurate tests. This video presentation includes illustrations from the free NPL Defect Database.