Tag Archives: components

IPC guidance regarding clearance space between components when designing a printed board

Technical Project Manager John Perry explains the clearance information in J-STD-001, IPC-2221 and IPC-7351.

Can I bake components at higher temperatures than what is allowed in J-STD-033B?

Technical Question of the Week: Can I bake components at higher temperatures than what is allowed in J-STD-033B?