What are the causes for solder skips?

 Bob Willis looks at the most common reasons for solder skips on surface mount during wave soldering and illustrates how pad length, solder mask thickness and gassing from solder mask and flux will contribute to the problem.   Bob, in conjunction with the National Physical Laboratory Defect Database, will have an on-site clinic at IPC […]

Do I need to clean my no-clean assembly?

IPC Manager of Assembly Technology Kris Roberson explains how the new IPC-CH-65 may change your views on cleaning. Learn more about IPC-CH-65B.

How to measure the thermal zone for boards with blind or buried vias.

IPC Technical Project Manager John Perry explains how to measure the thermal zone for boards with blind or buried vias using new concepts developed for the IPC-6012 industry standard.

Pad cratering, drop test failure and suggested solutions for pads and alloys

Industry expert Bob Willis uses the NPL Defect Database to explain pad cratering, drop test failure and suggested solutions for pads and alloys. 

Problems with Incomplete Reflow on “Intrusive” Solder Joints

Generally a reliable solder method, companies can experience problems with incomplete reflow on “intrusive” solder joints, i.e. “pin in paste” or reflow on through hole components. 90% of the time, a faulty profile is the culprit. Check out Bob Willis’s analysis of the phenomenon with illlustrations from the NPL Defect Database.

Causes of Solder Fillet Lifting

While it is not linked directly to solder reliability, solder fillet lifting can be worrisome. Where is it seen? What are its causes? Check out Bob Willis’s analysis of the phenomenon with illlustrations from the NPL Defect Database. Get your questions answered by Bob Willis in person at the free process defect database clinic at […]

Causes and solutions for popcorn defects in plastic packages

Industry guru Bob Willis discusses the causes of component cracking in rework and soldering and the solution: check out IPC standards for moisture sensitive components. Bob will provide free help on your problem boards and assemblies at the FREE NPL Defect Database Clinic at IPC APEX EXPO on April 12-14 on the show floor. With the […]

Causes and solutions for Solder Beading

Industry expert Bob Willis explains how to address solder beading, a defect usually found on chip components. Hint: it’s your stencils. Bob will provide free help on your problem boards and assemblies at the FREE NPL Defect Database Clinic at IPC APEX EXPO on April 12-14 on the show floor. With the help of equipment in […]